Kimya PLA-HI 750g filament
Kimya PLA-HI 3D Filament
The 3D PLA-HI filament has been formulated to quadruple its impact resistance compared to PLA-S.
- EASY TO PRINT
- RESISTANCE TO IMPACT
- NO ODOR
- BIOSOURCED MATTER
PRINT SETTINGS:
PRINT SPEED : 50 mm/s
EXTRUSION TEMPERATURE : 200°C
PLATFORM TEMPERATURE : 60°C
Made in USA. Ship from USA.
FILAMENT PROPERTIES
| PROPERTIES | TEST METHODS | VALUES |
|---|---|---|
| Diameter | INS-6712 | 1.75 ± 0.1 mm 2.85 ± 0.1 mm |
| Density | ISO 1183-1 | 1.21 g/cm3 |
| Moisture rate | INS-6711 | < 1 % |
| Melt flow index (MFI) | ISO 1133-1 (@210°C – 2,16 kg) | 5.7 g/10min |
| Glass transition temperature (Tg) | ISO 11357-1 DSC (10°C/min - 20-220°C) | 60 °C |
| Melting Temperature (Tm) | ISO 11357-1 DSC (10°C/min – 20-220°C) | 156 °C |
PRINT PARAMETERS AND SPECIMENS DIMENSIONS
| PRINTING DIRECTION | XY |
|---|---|
| Printing Speed | 50 mm/s |
| Infill | 100% - rectilinear |
| Infill Angle | 45°/-45° |
| Nozzle Temperature | 200°C |
| Bed T° | 60°C |
PRINTED SPECIMENS PROPERTIES
| PROPERTIES | TEST METHODS | VALUES | |
|---|---|---|---|
| MECHANICAL PROPERTIES | Tensile modulus | ISO 527-2/5A/50 | 2,491 MPa |
| Tensile Strength | ISO 527-2/5A/50 | 43 MPa | |
| Tensile strain at strength | ISO 527-2/5A/50 | 2 % | |
| Tensile Stress at Break | ISO 527-2/5A/50 | 22.9 MPa | |
| Tensile strain at break | ISO 527-2/5A/50 | 4.2 % | |
| Flexural modulus | ISO 178 | 2,097 MPa | |
| Flexural stress at conventional deflection (3,5% strain)* | ISO 178 | 62.8 MPa | |
| Charpy impact resistance | ISO 179-1/1eA | 16.5 kJ/m² | |
| Shore Hardness | ISO 868 | 76,8D |
| Note 1 | *According to ISO 178, end of the test at 5% deformation even if there is no specimen break. |
| Note 2 | The data should be considered as indicative values - Properties can be influenced by production conditions. |